Presentation: Future Digital Twin & AI (Amsterdam) 2026 - DEXPI

Presentation: Future Digital Twin & AI (Amsterdam) 2026 – DEXPI

At Future Digital Twin & AI (Amsterdam) 2026, Dr. Michael Wiedau of DEXPI explored how structured, interoperable engineering data can provide the foundation for industrial-grade AI.

The Core of Industrial Grade AI

Dr. Michael Wiedau, Chairman of the Board, DEXPI

Dr. Michael Wiedau, Chairman of the Board at DEXPI, follows a clear path from the engineering data problem to the structured foundation and intelligence required for industrial-grade AI.

The presentation explains why engineering remains data-rich but has achieved limited real-world AI adoption. Information is often fragmented across proprietary formats, while valuable Piping and Instrumentation Diagrams remain locked in PDFs without the structure, semantics or interoperability AI systems require.

DEXPI addresses this challenge by providing an open, neutral and reliable data exchange standard for the process industry. It transforms engineering diagrams into structured, machine-readable information and allows organisations to exchange data rather than static documents across systems, companies and disciplines.

Once this information is represented through connected structures and knowledge graphs, AI can begin to reason across engineering relationships. Potential applications include flowsheet completion, converting Process Flow Diagrams into P&IDs, identifying and correcting errors, and supporting AI-augmented HAZOP studies.

Explore the full presentation below to discover how standardised engineering data can provide the foundation for trusted AI, improve digital collaboration and unlock new workflows across process engineering.

Related News Articles

Share

or register now if you have not already